Tantalum Nitride (TaN) Sputtering Targets

Tantalum nitride (TaN) is an inorganic chemical compound. It is sometimes used to create barrier or "glue" layers between copper, other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits to create thin film surface mount resistors and have other electronic applications.
Our Tantalum nitride (TaN) sputtering target are available in a variety of sizes and shape in planar or cycle.