Tungsten Titanium (WTi) Sputtering Targets

Tungsten Titanium Sputtering Targets are produced by powder metallurgy technology which are widely used for semiconductor and thin film solar cells.
For semiconductor application, WTi10wt% thin film is used as diffusion barrier and adhesion layer, to separate the metallization layers from semiconductor, for instance, separate aluminum from silicon, or copper from silicon. Thus, the function of semiconductor in microchips can be improved significantly.
Our Tungsten Titanium sputtering target are available in a variety of sizes and shape in planar or cycle.