Aluminium Copper (AlCu) Sputtering Target

Aluminum Copper（AlCu）alloy Sputtering Target is produced by vacuum melting technology, usually used for IC production as interconnect materials. Compared to aluminum interconnects, high purity aluminum copper AlCu(0.5-4%) interconnects have more uniform inner micro-structure, and the interconnects’ electromigration and diffusion to wafer can be improved effectively. With 5N high purity, uniform grain size, lower oxygen content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.
Our aluminum copper sputtering target are available in a variety of sizes and shape in planar or cycle.